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dc.contributor.authorSerga, Vera
dc.contributor.authorZarkov, Aleksej
dc.contributor.authorShishkin, Andrei
dc.contributor.authorElsts, Edgars
dc.contributor.authorMelnichuks, Maksims
dc.contributor.authorMaiorov, Mikhail
dc.contributor.authorBlumbergs, Ervins
dc.contributor.authorPankratov, Vladimir
dc.date.accessioned2024-03-15T16:53:52Z
dc.date.available2024-03-15T16:53:52Z
dc.date.issued2023
dc.identifier.issn2075-4701
dc.identifier.urihttps://www.mdpi.com/2075-4701/13/4/662
dc.identifier.urihttps://dspace.lu.lv/dspace/handle/7/65494
dc.descriptionThis research was supported by ERDF project no. 1.1.1.1/20/A/139 “Development of sustainable recycling technology of electronic scrap for precious and non-ferrous metals extraction”. The project was co-financed by REACT-EU funding to mitigate the effects of the pandemic crisis. The article was published with financial support from the Riga Technical University Research Support Fund. This research was also supported by the Institute of Solid State Physics, University of Latvia, as the Center of Excellence has received funding from the European Union’s Horizon 2020 Framework Program H2020-WIDESPREAD-01-2016-2017-TeamingPhase2 under grant agreement No. 739508, project CAMART2.en_US
dc.description.abstractThis paper presents the results of the leaching of metals from computer PCBs by electrochemical hydrochlorination using alternating current (AC) with an industrial frequency (50 Hz). Leaching was carried out with a disintegrator-crushed computer motherboard with a particle size (d) of <90 μm. In the course of the research, the leaching efficiency of metals including Fe, Sn, Mn, Al, Cu, Zn, Pb, Ni, Ti, Sb, Cr, Co and V was evaluated depending on process parameters, such as AC density, experiment duration, hydrochloric acid concentration in the electrolyte solution, solid/liquid ratio, electrolyte temperature, and the loading option of raw material (loading option 1 involving loading into the electrolyte solution, and loading option 2 involving loading into the filter containers attached to electrodes). The research results showed that AC superimposition significantly intensifies the leaching of metals. It was established that the complete leaching of metals including Al, Mn, Sn, Ti and Zn, under experimental conditions (loading option 2, CHCl = 6 mol·L−1, i = 0.80 A·cm−2, S/L = 8.6 g·L−1), is reached after 1.5 h, and that of Cu and Ni is reached after 2 h from the beginning of the experiment. At the same time, the degree of leaching of other metals after 2 h is Co-78.8%, Cr-84.4%, Sb-91.7%, Fe-98.9%, V-98.1% and Pb-5.1%. The paper also reports the results on the leaching of all abovementioned metals, as well as Ag and Pd, with disintegrator-crushed mixed computer PCBs with d < 90 μm and loading option 1. --//-- This is an open access article Serga, V.; Zarkov, A.; Shishkin, A.; Elsts, E.; Melnichuks, M.; Maiorov, M.; Blumbergs, E.; Pankratov, V. Study of Metal Leaching from Printed Circuit Boards by Improved Electrochemical Hydrochlorination Technique Using Alternating Current. Metals 2023, 13, 662. https://doi.org/10.3390/met13040662 published under the CC BY 4.0 licence.en_US
dc.description.sponsorshipERDF project no. 1.1.1.1/20/A/139; REACT-EU funding; Riga Technical University Research Support Fund; the Institute of Solid State Physics, University of Latvia, as the Center of Excellence has received funding from the European Union’s Horizon 2020 Framework Program H2020-WIDESPREAD-01-2016-2017-TeamingPhase2 under grant agreement No. 739508, project CAMART2.en_US
dc.language.isoengen_US
dc.publisherMDPIen_US
dc.relationinfo:eu-repo/grantAgreement/EC/H2020/739508/EU/Centre of Advanced Material Research and Technology Transfer/CAMART²en_US
dc.relation.ispartofseriesMetals;13(4), 662
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectResearch Subject Categories::NATURAL SCIENCES::Physicsen_US
dc.subjectprinted circuit boardsen_US
dc.subjectelectrochemical hydrochlorinationen_US
dc.subjectleachingen_US
dc.subjectalternating currenten_US
dc.subjectbase metalsen_US
dc.subjectsilveren_US
dc.subjectpalladiumen_US
dc.titleStudy of Metal Leaching from Printed Circuit Boards by Improved Electrochemical Hydrochlorination Technique Using Alternating Currenten_US
dc.typeinfo:eu-repo/semantics/articleen_US
dc.identifier.doi10.3390/met13040662


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